TLDR: Corintis, a semiconductor cooling startup, has raised $24 million in Series A funding, bringing its total to $33.4 million. The company is tackling the critical AI bottleneck of chip overheating, announcing a significant collaboration with Microsoft that has resulted in a 3x improvement in chip cooling efficiency. This breakthrough utilizes Corintis’s microfluidic cooling technology, essential for the escalating power demands of next-generation AI accelerators.
Lausanne, Switzerland – September 25, 2025 – Corintis, a pioneering semiconductor cooling startup, has successfully closed a $24 million Series A funding round, elevating its total capital raised to $33.4 million. This substantial investment is earmarked to accelerate the company’s mission to overcome the escalating thermal challenges posed by advanced artificial intelligence (AI) chips, a critical bottleneck hindering the industry’s rapid expansion.
The funding round was spearheaded by BlueYard Capital, with notable participation from Founderful, Acequia Capital, Celsius Industries, and XTX Ventures. The capital infusion will enable Corintis to scale its operations, expand its manufacturing capabilities, and further develop its innovative cooling solutions.
As AI models become increasingly complex and powerful, the computational demands on chips skyrocket, leading to a significant increase in heat generation. Early versions of OpenAI’s ChatGPT, for instance, utilized NVIDIA chips consuming 400W. Just four years later, new GPUs and AI accelerators are projected to require ten times that power, making traditional air cooling insufficient and necessitating advanced liquid cooling solutions. NVIDIA’s recent adoption of liquid cooling for its data center GPUs underscores this urgent industry need.
Corintis addresses this challenge with its proprietary “co-designed microfluidic cooling” technology. This involves developing best-in-class simulation and optimization software, alongside novel manufacturing methods, to create micro-scale optimized liquid cooling systems. These systems are precisely adapted to the chip architecture, ensuring efficient heat removal by delivering liquid directly to critical hot spots.
A landmark achievement for Corintis is its collaboration with Microsoft, which has resulted in a breakthrough demonstrating a three-fold improvement in chip cooling efficiency. This was achieved through an in-chip microfluidic cooling system, with tests confirming its superior heat removal capabilities compared to the most advanced technologies currently in use. A spokesperson for Corintis highlighted the significance, stating, “As our recent collaboration with Microsoft highlights, there’s an industry-wide push to advance the limits of cooling to enable a future of compute that’s not limited by heat.”
The company’s leadership team has also been bolstered with the addition of industry veterans to its board of directors. Lip-Bu Tan, Chairman of Walden International and former Intel CEO, has joined as a board director and investor, alongside Geoff Lyon, former CEO and Founder of CoolIT. Mr. Tan commented on the critical nature of Corintis’s work: “Cooling is one of the biggest challenges for next-generation chips. Corintis is fast becoming the industry leader in advanced semiconductor cooling solutions to address the thermal bottleneck, as made evident by its growing customer list.”
Corintis is rapidly expanding its global footprint, with plans to open multiple US offices to better serve its American clientele, in addition to an Engineering office in Munich, Germany. The company aims to grow its team from 55 to over 70 employees by the end of the year and significantly ramp up its manufacturing capacity, targeting over a million microfluidic cold plates annually by 2026. To date, Corintis has already deployed more than 10,000 cooling systems and achieved 8-digit revenue, working with top-tier clients including its collaboration with Microsoft.
Beyond its core microfluidic cooling, Corintis has developed a suite of technology platforms, including Glacierware for automating cooling system design, a copper microfluidic manufacturing facility capable of producing cold plates with features as small as a human hair, and Therminator, a platform allowing chip companies to physically emulate next-gen chips with millimeter accuracy on silicon test chips before production. This comprehensive approach not only enhances thermal performance but also enables data centers to reduce their water consumption, addressing a key ecological concern of AI technologies.
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The company’s innovations are poised to have a profound impact not only on the AI sector but also on broader computational applications such as climate modeling and drug discovery, where high-performance computing is paramount.
