TLDR: Global AI semiconductor firm DEEPX has been honored with two CES 2026 Innovation Awards for its advanced AI semiconductors. Concurrently, its DX-M1 chipset is the core technology behind Sixfab’s ALPON X5 AI gateway, which received CES’s highest distinction, the “Best of Innovation” award. This achievement highlights DEEPX’s growing influence in “Physical AI” and its commitment to a global partner ecosystem, demonstrating practical, scalable AI deployment in industrial settings.
SEOUL, South Korea and LAS VEGAS – November 5, 2025 – DEEPX, a leading global AI semiconductor company led by CEO Lokwon Kim, has once again garnered significant international recognition, securing two CES 2026 Innovation Awards. This year’s accolades were awarded in the highly competitive Computer Hardware and Embedded Technology categories, underscoring DEEPX’s continued leadership in AI innovation. In a monumental achievement for its partner, Sixfab, a US-based IoT and edge computing company, received the prestigious “Best of Innovation” award – CES’s highest honor – for its groundbreaking AI gateway, the ALPON X5, which is powered by DEEPX’s DX-M1 chipset.
The DX-M1, DEEPX’s first-generation AI chipset, is an ultra-low-power, high-performance AI semiconductor. It boasts over ten times greater power efficiency than traditional GPUs, capable of performing high-precision AI inference at less than 5 watts. This remarkable efficiency allows for GPU-level accuracy with significantly reduced heat generation and cost, making reliable AI operations feasible even in power-constrained industrial and infrastructure environments.
The ALPON X5, integrating DEEPX’s DX-M1, was lauded by the CES judging panel as a “realistic and scalable AI infrastructure model.” It is positioned as a next-generation on-device AI gateway designed to replace cloud-centric AI architectures. The device is considered a pivotal transitional solution towards the AI-6G era and a foundational element for future intelligent network infrastructure. Its ability to perform real-time data processing and analysis directly at the edge, without heavy reliance on cloud resources, enables ultra-low latency and intelligent control across industrial, urban, and transportation systems. This capability is crucial for the upcoming “AI 6G RAN” (Radio Access Network) architecture, where AI is directly integrated into network nodes and base stations.
Lokwon Kim, CEO of DEEPX, expressed his pride in the collaboration, stating, “Winning the CES Best of Innovation award signifies Sixfab’s official recognition for its pursuit of practical AI innovation. DEEPX’s DX-M1 chip has turned our long-term vision for ultra-efficient, high-performance edge computing into reality. With ALPON X5, global customers can now build more efficient and sustainable AI infrastructure.”
This latest triumph builds on DEEPX’s impressive track record at CES. At CES 2024, the company made history as the first AI semiconductor firm to achieve a “triple crown,” winning Innovation Awards in the Robotics, Embedded Technology, and Hardware Components categories with the very same DX-M1 chipset. Following this, at CES 2025, the Consumer Technology Association (CTA) officially recognized DEEPX as a “Must-See Company,” attracting over 16,000 visitors to its exhibition booth.
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CES 2026, scheduled from January 6-9 in Las Vegas, will be a significant event for DEEPX. The company plans to showcase its award-winning products and jointly exhibit the “Best of Innovation” ALPON X5 with Sixfab. Furthermore, DEEPX will host the newly established CES Foundry forum, where it will articulate its industrial vision and technological roadmap for the “Physical AI” era alongside global partners. The company also intends to hold a media conference at the event to officially unveil its next-generation ultra-low-power AI semiconductors and announce its global ecosystem strategy, aiming to establish new industry standards for on-device AI.
