TLDR: TDK Ventures has made a strategic investment in EdgeCortix, a leading fabless semiconductor company, as part of its oversubscribed Series B funding round. This investment, alongside other new and existing investors, brings EdgeCortix’s total Series B funding to over US$110 million, further accelerating the global deployment and mass production of its energy-efficient edge AI processing platforms, including the SAKURA-II AI co-processors and the upcoming SAKURA-X chiplet architecture.
SAN JOSE, Calif. & TOKYO – November 6, 2025 – TDK Ventures, the corporate venture-capital subsidiary of TDK Corporation, has announced its participation in the Series B funding round of EdgeCortix Inc., a pioneering fabless semiconductor company focused on energy-efficient Artificial Intelligence (AI) processing at the edge. This strategic investment is set to significantly bolster EdgeCortix’s global expansion initiatives and accelerate the advancement of its cutting-edge edge AI processing platform.
EdgeCortix recently closed the second tranche of its oversubscribed Series B financing round, pushing its total funding to more than US$110 million. The round, which closed over 30% oversubscribed, reflects strong global investor confidence in EdgeCortix’s power-efficient AI processing technology, its proven execution track record, and its growing market momentum. New investors in this round include TDK Ventures, CDIB Cross Border Innovation Fund II LP (CCBI), and Jane Street Global Trading. They join previously announced investors from the first close, such as Yanmar Ventures, Pacific Bays Capital, NTT Finance Corporation, SiC Power, and Aero X Ventures, with continued participation from existing investors SBI Investment and Global Hands-On VC (GHOVC). Pacific Bays Capital also made additional investments in this second close of Series B.
In addition to the equity financing, EdgeCortix has secured a ¥1.5 billion (approximately US$10 million) unsecured credit facility from Mizuho Bank, Ltd., further strengthening its balance sheet and long-term banking relationship. Earlier this year, the company also received a substantial ¥3 billion (approximately US$20 million) government-backed project from Japan’s New Energy and Industrial Technology Development Organization (NEDO) to develop a next-generation low-power AI inference and learning chiplet platform.
The combined proceeds from the Series B round and the credit facility will be channeled into accelerating research and development, expanding global go-to-market strategies, and scaling up the mass production of EdgeCortix’s flagship hardware and software platforms. This includes the highly successful SAKURA-II AI co-processors, which have already secured design-wins, and the upcoming SAKURA-X chiplet architecture designed for efficient AI inference applications.
Ankur Saxena, Investment Director at TDK Ventures, commented on the investment, stating, “EdgeCortix is driving innovation in semiconductor solutions for the connected intelligent edge. Their ‘software-first’ architecture, an ‘OS for Edge AI,’ unites reconfigurable silicon with an intelligent compiler for maximum efficiency. This approach aligns with TDK’s broader vision for intelligent, energy-efficient technologies at the edge. TDK Ventures is proud to support EdgeCortix as they scale globally across industries such as robotics, smart infrastructure, and beyond.”
Also Read:
- DEEPX Unveils “Physical AI” Vision and Receives Prestigious MINDS 2025 Award at World Economic Forum
- Nvidia Bolsters India’s Deep Tech Sector with Strategic Alliance and Nearly $1.9 Billion in Funding
Established in 2019 and headquartered in Tokyo, Japan, with additional offices in the United States and India, EdgeCortix specializes in developing silicon-based, energy-efficient AI processors specifically engineered for Generative AI workloads at the edge. The company’s patented hardware-software co-design methodology enables highly efficient runtime-reconfigurable AI accelerators, delivering industry-leading performance-per-watt for edge inference across diverse applications including defense, aerospace, smart cities, Industry 4.0, robotics, and telecommunications.
