TLDR: Tata Consultancy Services (TCS) has launched its Chiplet-based System Engineering Services, a strategic initiative to help semiconductor companies design next-generation chips. This move aims to deliver faster, more efficient, and powerful processors by leveraging chiplets as modular building blocks, addressing the increasing global demand for advanced semiconductors and bolstering India’s ambition to become a global semiconductor hub. The new services are designed to overcome traditional chip design bottlenecks and accelerate time-to-market for complex multi-chip products.
Mumbai, India – Tata Consultancy Services (TCS), a global leader in IT services, consulting, and business solutions, announced on September 11, 2025, the launch of its innovative Chiplet-based System Engineering Services. This new offering is set to transform the semiconductor industry by enabling companies to push beyond the limitations of traditional monolithic chip design, fostering the creation of next-generation processors that are faster, more efficient, and significantly more powerful.
The semiconductor landscape is currently experiencing a pivotal shift. For decades, Moore’s Law dictated the industry’s progress through the continuous shrinking of transistors to pack more components onto a single chip. However, this approach is encountering significant physical and economic bottlenecks. In response, the industry is increasingly adopting chiplet-based design, where multiple smaller, specialized integrated circuits (chiplets) are combined to form a larger, more complex system. This modular approach allows for greater flexibility, scalability, and cost-effectiveness in chip manufacturing.
TCS’s new services are designed to provide comprehensive support across the entire chiplet ecosystem. This includes the design and verification of industry standards such as Universal Chiplet Interconnect Express (UCIe) and High Bandwidth Memory (HBM). Furthermore, the Mumbai-headquartered company will offer advanced package design services, including 2.5D and 3D interposers and multi-layer organic substrates, which are crucial for connecting and supporting multi-chip packages.
According to V Rajanna, President, Technology, Software and Services, TCS, “TCS Chiplet-based System Engineering services will help semiconductor enterprises accelerate chiplets tapeout, driving flexibility, scalability, and faster time to market. Our extensive investments in next-gen technologies, contextual knowledge of the semiconductor industry, and strong track record in execution make us the preferred partner to drive innovation at scale.”
The timing of this launch is particularly significant for India. The country’s semiconductor market, valued at an estimated $45–50 billion in 2024-2025, is projected to more than double to $100–110 billion by 2030. This growth is strongly supported by the Indian government’s ₹76,000 crore India Semiconductor Mission, which aims to establish India as a major global hub for chip design and manufacturing. With India already contributing 20% of the world’s chip design engineers, TCS’s new services are expected to further strengthen this momentum by providing both domestic and international companies with access to world-class expertise in chip-to-system engineering.
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The demand for advanced semiconductors is soaring, driven by the rapid expansion of technologies such as AI, cloud computing, smartphones, electric vehicles, and connected devices. Chiplet-based architectures are uniquely positioned to meet these demands, enabling the creation of highly customized and energy-efficient processors tailored for specific workloads, including those in artificial intelligence. TCS has already demonstrated its capabilities in this area, having partnered with a leading North American semiconductor firm to simplify the integration of diverse chiplets into AI processors, thereby reducing delivery timelines.
