TLDR: Hyper, a prominent innovator in mobile tech accessories, has been honored with two CES 2026 Innovation Awards for its HyperSpace™ Trackpad Pro and HyperDrive® Next USB4 M.2 PCIe Enclosure. These awards recognize the products’ exceptional design and engineering, with the HyperDrive® Next notably supporting AI accelerators, highlighting Hyper’s commitment to advanced, future-ready solutions.
ANAHEIM, Calif. – Hyper®, a leading name in mobile technology accessories for creators and power users, proudly announced today that it has been bestowed with two prestigious CES 2026 Innovation Awards® in the Consumer Peripherals and Accessories category. This recognition underscores Hyper’s unwavering dedication to pioneering breakthrough solutions that empower users to enhance their creative, connectivity, and device capabilities.
Gabi Iorio, Director of Global Marketing and Sales at Hyper, commented on the achievement, stating, “For two decades, Hyper has consistently led the tech accessory landscape by introducing industry-defining ‘world’s firsts’ across power, connectivity, mobility, and desktop solutions. These CES Innovation Awards 2026 Honorees serve as a powerful validation of our company’s continuous and relentless commitment to challenging conventions, pushing boundaries, and delivering transformative technology to today’s mobile tech users.”
The two award-winning products are:
1. HyperSpace™ Trackpad Pro (HS2510GL): This innovative device marks the debut of a premium haptic trackpad specifically engineered for Microsoft® Windows® environments. It boasts zero-latency input, 240Hz responsiveness, and independent pressure sensing for up to 10 fingers. Integrated with Hydra® Connect software, the Trackpad Pro allows users to craft app-specific shortcuts, define gesture zones, and customize deep-click profiles for unparalleled precision and personalization. Its ergonomic design, intelligent palm rejection, and a community-driven shortcut sharing feature position it as a significant advancement for digital creators and multitaskers. The HyperSpace Trackpad Pro is currently available for pre-order on Kickstarter, with early bird pricing starting at $90, and is slated for arrival in Q1 2026.
2. HyperDrive® Next USB4 M.2 PCIe Enclosure (HD2500GL): Designed as a modular, high-speed expansion solution, this enclosure delivers an impressive 64Gbps PCIe throughput. Crucially, it supports AI accelerators and networking cards, making it a forward-looking accessory for professionals working with advanced computing needs. The enclosure features a hybrid power system to ensure stable performance even with low-power devices. Built on Intel’s Barlow Ridge chipset, it offers tool-less installation, IP55-rated durability, and is constructed from 100% recycled aluminum, emphasizing sustainability alongside its high-performance capabilities. The HyperDrive® Next USB4 M.2 PCIe Enclosure is expected to be available by the end of Q4 2025, with a retail price of $199.99.
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Consumers, media, and industry professionals will have the opportunity to experience these award-winning innovations firsthand at CES 2026, scheduled to take place in Las Vegas from January 6–9, 2026. Hyper will showcase its latest products alongside its parent company, Targus, in Suite #35-106 at The Venetian. Additionally, both CES Innovation Awards Honorees will be prominently featured in the CES Innovation Awards Showcase and during CES Unveiled, the premier media preview event held at the Mandalay Bay Convention Center on the evening of January 4. This news highlights Hyper’s continued influence in the tech accessory market, bringing cutting-edge solutions that cater to the evolving demands of modern digital workflows and advanced computing.
